Ufs Bga 254 Datasheet Jun 2026

With 0.5mm pitch, microvias (150/250µm) are mandatory. Use dog-bone or via-in-pad plated-over (VIPPO) for inner rows. Never route signals between balls on the same layer—use HDI (High Density Interconnect) stackup with blind vias.

As UFS evolves to 4.0 and beyond, the BGA 254 form factor will remain a cornerstone of high-performance embedded storage—and the datasheet will remain your most trusted tool. Ufs Bga 254 Datasheet

| Parameter | Min | Typ | Max | Unit | |-----------|-----|-----|-----|------| | VCC (Performance mode) | 2.7 | 3.3 | 3.6 | V | | VCCQ | 1.14 | 1.2 | 1.26 | V | | Sleep current (Idle) | - | 1.2 | 2.0 | mA | | Active read (4KB random) | - | 250 | 350 | mW | | Active write (Seq 1MB) | - | 450 | 600 | mW | With 0